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2020年8月2日 星期日

Acrosser New 2U IoT Rackmount Server


In response to the rising of artificial intelligence (AI), high-definition audio and video streaming and online live broadcast, data high-speed computing and transmission applications, Intel and AMD have launched a new generation of server platform products, including Intel’s next-generation Xeon® scalable processor family - Purley CPUs which are based on the Skylake-SP architecture and planned to replace the previous both Xeon® E5 and E7 processors powered by Broadwell microarchitecture.

Purley’s new platform combines multiple platform innovations and integrates performance enhancement technologies, including Intel AVX-512, Intel MESH architecture, Optane Solid State Drive (SSD), and Omni-Path Fabric fiber optic transmission technology. Purley’s new platform also supports existing and emerging data center and network workloads, including cloud computing, high-performance computing, and artificial intelligence, etc. The evolving data center and network infrastructure are designed to deliver the industry’s highest energy efficiency and system-level performance. Its average performance is 1.65 times higher than the previous generation. The performance of the Xeon® expandable processor is 2.2 times more efficient than the previous generation under the ever-increasing workload of artificial intelligence.

Acrosser Technology now is providing customers the Purley’s new platform network appliances, the Acrosser first 2U IoT Rackmount Server: ANR-C627/622N1. Positioned as powerful network appliances, ANR-C627/622N1 equipped with the latest generation Intel® Xeon® Scalable processors are perfect for IoT Gateway, Edge Computing (EC), Cloud, Next-Generation Firewall (NGFW), IPS/IDS, Security Gateway (Se-GW), Unified Threat Management (UTM) and Network Functions Virtualization (NFV). As excellence network appliances, ANR-C627/622N1 series support dual-socket Intel® Xeon® Scalable processors, 24* RDIMM/LRDIMM DDR4-2666, dual onboard SFP+ (10G fiber) and 8* Expandable Network Interface Modules (NIMs) for 1G/10G/40G (fiber/Copper/Bypass) various options. Strong networking ability can meet most of the enterprise-class customers’ needs.

Acrosser had committed its valuable resources to further develop its advanced network product lines. Furthermore, Acrosser is now working directly with Intel, as part of Intel IoT Solutions Alliance, in order to be able to offer its customers first-to-market services, the latest technologies, and solutions in a timely manner. As a member of the Intel IoT Solutions Alliance, Acrosser is able to directly obtain valuable resources in providing high quality and stable performance products/solutions to its customers, vis-à-vis non-IoT-Alliance-members.
For pricing and availability, please send your inquiry at http://www.acrosser.com/inquiry.html
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2013年9月24日 星期二

Board makers and its dilemma



Millions of maker boards have shipped to date, mostly as an extension of a thriving young DIY community. However, as open networking platforms continue to surface as alternatives for commercial product development, it is possible that a generation of embedded engineers is being brought up by maker. GizmoSphere has also entered the maker market with x86 process technology, including an AMD Embedded computer G-Series APU capable of 52.8 GFLOPS at under 10 W on their Gizmo board. Part of the Gizmo Explorer Kit, the package “was designed to be flexible so that designers can customize the system according to their specific development goals,” says Kerry Brown, Vice President and Chief Operations Officer, Sage Industrial Electronic Engineering.

“Gizmo was created to provide a flexible, multipurpose development board to serve the unique needs of embedded developers,” Brown says. “There is a wide range of interfaces on the Gizmo board, including PCIe, I2C, USB, and GPIO … to enable each developer’s unique design goals. The companion Explorer board provides a sea of holes for industrial prototyping and debugging. The kit can be used by hobbyist developers who want to tinker at home on the weekends, or by entrepreneurs and small businesses developing their next product.”

refer to:
http://embedded-computing.com/articles/diy-pushes-open-hardware-kindergarten-kickstarter/